Test Method:

XPS (X-ray Photoelectron Spectroscopy)

Equipment:

PHI-5400, Physical Electronics, US

X-ray Source:

Al Ka (1486.6 eV)

Applications:

• Qualitative composition analysis

Confirm the existence of certainelement (sensitivity 0.1 at%), but XPS is less accurate for quantitative analysis;

• Valance state analysis

Analyze the chemical environment and valance states of the elements on the sample surface.

• XPS Depth Profile

Using Ar ions to sputter and etch the sample and perform XPS analyses after each etching cycle.

Analysis Depth:

• <5 nm for metal, inorganic materials;

• <10 nm for plastic, polymers, organic materials.

Test Time:

• 7 Working Days

Useful Links:

• XPS on Wikipedia

Standard Testing Methods:

For thin film samples:

       [1].    Broad scan;

       [2].    Narrow scan for required elements (such as Zr. Ti, Y, C, O, etc);

       [3].    Ar ion etching (depth 3-5 nm);

       [4].    Broad scan again;

       [5].    Narrow scan for required elements again;

       [6].    Provide 2 sets of data beforeand after etching.

For powder samples:

       [1].    Broad scan;

       [2].    Narrow scan for required elements (such as Zr. Ti, Y, C, O, etc);

       [3].    Provide 1 set of data beforeand after etching.